Multi-chip packaging modules are a significant aspect of modern miniaturization electronics and microelectronic systems. There will continue to grow demand for more miniaturization of consumer goods, aerospace and defense systems, medical devices and LED arrays. The Multi-Chip Module (or MCM) was designed to encourage its use as a single package for multiple integrated circuits (or ICs). Multi-chip modules differ depending on their designers 'complexity and engineering strategies, and consumer or end-user needs. For example, on a small printed circuit board, one customer can require pre-packaged ICs to duplicate the product footprint of an existing chip product. Another customer can need a completely customized package, which includes several chips on a substratum.
Get Free Sample Report @ https://www.marketresearchfuture.com/sample_request/7380
Multichip modules (MCM) are, in fact, hybrid microcircuits in which the packaging technology was further motivated by the need to get the maximum electrical output from VLSI and other high-speed devices. While there is no clear concept of MCMs and although almost every electronic module is called an MCM because of its glamour, MCMs are in fact the latest generation of hybrid microcircuits in which the materials and processes have been optimized and expanded to achieve at least an improvement in electrical efficiency in order of magnitude (such as speed) and the order of magnitude the density increases. To accomplish this, low dielectric-constant materials, including polymers and some ceramics, are used as dielectric interlayers for interconnecting multilayer substrates to monitor impedances, minimize signal attenuation and increase speeds. In addition, very fine conductor lines, narrow vias and short electrical paths are used to boost electrical efficiency and increase the packaging capacity, resulting in lighter, smaller, and higher electronic speeds.
Segmentation
The global Multi-Chip Modules Industry Analysis is segmented into type and industry vertical.
By type, the market is segmented into NAND-based MCP, NOR-based MCP, eMCP, and uMCP.
By industry vertical, the market is segmented into consumer electronics, automotive, medical devices, aerospace and defense, and others. The consumer electronics vertical is expected to generate revenue sales for the global multi-chip module industry owing to consumption of consumer electronic products. The need for extended memory for storing multimedia files and higher processing power for running simulations and rendering of animated sequences can drive the segment growth. On the other hand, the automotive vertical can capture a large market share owing to emergence of connected cars and rise in development of autonomous vehicles.
Regional Analysis
Asia Pacific is expected to dominate the global multi-chip module market during the forecast period. The region is considered as the most potential region in terms of development and adoption of multi-chip modules and respective electronic products. It has a huge potential for revenue generation in the multi-chip module market, particularly from consumer electronics industry vertical. China is expected to be the dominating country in the multi-chip module market in Asia-Pacific region during the forecast period.
North America is expected to grow at the fastest rate during the forecast period. Innovative technologies and presence of many leading vendors in the region are some of the driving factors for the multi-chip module market in the region.
Competitive Outlook
TEKTRONIX, INC., Micross, Cypress Semiconductor, Palomar Technologies, Macronix International Co., Ltd., Texas Instruments, Samsung Electronics, SK HYNIX INC., STMicroelectronics, and Infineon Technologies are key players of the global multi-chip module market.
Recently, NEC Corporation agreed to partner with NXP Semiconductors for supply of MCM modules for its use in a 5G radio antenna unit. This can expedite the deployment of 5G technologies globally.
Get Complete Report @ https://www.marketresearchfuture.com/reports/multi-chip-module-market-7380
Media Contact:
Market Research Future (Part of Wantstats Research and Media Private Limited)
99 Hudson Street, 5Th Floor
New York, NY 10013
United States of America
+1 628 258 0071 (US)
+44 2035 002 764 (UK)
Website: https://www.marketresearchfuture.com
Comments